COREnect participation at the EuCNC & 6G Summit
This year the EuCNC & 6G Summit was held virtually from the 8th until the 11th of June, 2021.
COREnect had a strong presence at the conference with both a panel and a dedicated workshop.
Today, Europe is strongly dependent on the supply of integrated circuits for various subsystems (e.g. CPU, optical module, …) by chipset vendors from other continents. From an economic and a robustness of supply chain perspective, this is an urgent matter for Europe to address on the road to 6G.
European Core Technologies for future connectivity systems and components (COREnect) is a coordination and support action (CSA) project that brings major European stakeholders from both the telecommunication and microelectronics industries together, along with connectivity-enabled vertical industries. It is part of the 5G Public-Private Partnership.
COREnect is developing a cross-industry technology roadmap of core component and subsystem technologies for the evolution of 5G towards 6G. The strategic goal of the project is to help diversify and reduce European dependence on other continents when building up future connectivity systems.
On the 8th of June COREnect had a dedicated workshop entitled “Hardware enabling technologies for 6G networks”. The purpose of the workshop was to present the key findings of the COREnect Expert Groups.
Colin Willcock, from 5GIA, with the presentation entitled “Hardware enabling technologies to ensure EU’s digital autonomy in 6G networks: The COREnect approach”. Find the presentation here.
Patrick Pype, from NXP, with the presentation entitled “Electronics for Trustworthy Communication (6G and beyond)”. Find the presentation here.
Piet Wambacq, from IMEC, who spoke about the “Future Core Technologies and Integration”.Find the presentation here.
It was moderated by Jacques Magen (AUSTRALO).
During the workshop, there was a panel entitled “Opportunities and Challenges for hardware enabling technologies in the SNS Partnership”, with the participation of Gerhard Fettweis (TUD) who talked about Energy Efficient, Green Communications Electronics.
The moderator of the panel was Yaning Zou (TUD).
Panelists involved:
Mohand Achouche (Nokia).
Patrick Cogez (AENEAS); Frank Hoffman (BOSCH).
Alexandros Kaloxylos (5G IA); Guillaume Vivier (SEQUANS).
Fredrik Tillman (Ericsson).
Ludger Verweyen (Infineon).
On the 11th of June COREnect participated in the EuCNC with a dedicated panel. It focused on “Components and hardware on the road to 6G” and was moderated by the COREnect coordinator prof. Gerhard Fettweis (Vodafone Chair Professor, TU Dresden, DE).
The panelists who addressed the 6G challenges were:
Caroline Bedran (Director General, Association for European NanoElectronics ActivitieS (AENEAS), FR). Find the video of the presentation here.
Björn Ekelund (Corporate Director, Hardware, Device, and Electromagnetics Research, Ericsson, SE). Find the video of the presentation here.
Lars Reger (EVP and CTO, NXP semiconductors, NL). Find the video of the presentation here.
Thomas Kropf (President, Corporate Research and Advanced Engineering, Robert Bosch GmbH, DE). Find the video of the presentation here.
This panel elaborated on the first COREnect’s findings and results related to the expected role of microelectronics in 6G. Ideas and recommendations on strategic measures to address these challenges, as well as the potential roles of the various stakeholders in such future 6G ecosystems were discussed.
EuCNC has been an opportunity for COREnect to discuss interim outcomes and recommendations of the project with a broad ICT audience, opening the road towards a high-level strategic roadmap of core subsystem and component technologies for supporting 5G and 6G systems with a more complete picture of the challenges and opportunities in the evolution towards 6G in Europe.
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