A R&I roadmap for European Leadership in Digital Infrastructures

How should Europe address future connectivity technologies and achieve European leadership in microelectronics and connectivity with a value-chain approach?

Developed between 2020 and 2022, with the participation of 100+ technical experts from 50+ organisations across Europe, the COREnect strategic R&I roadmap D3.6 Final COREnect Industry Roadmap is now finalised providing detailed insights on strategic actions required to achieve European leadership in microelectronics and connectivity within the next 10 years.

To facilitate the roadmapping work, three (3) expert groups were established focusing on 3 strategic focus areas that are critical for addressing microelectronics needs to support future connectivity:

·        Expert Group #1 Compute & Store Chair Gerhard Fettweis (TU Dresden)

o   Scope: identifies open challenges for innovations in the area of digital computing chips that would ensure European technological sovereignty.

o   Managed by Viktor Razilov (TU Dresden)

·        Expert Group #2 Connect & Communicate –Chair Piet Wambacq (imec), vice-chairs Frederic Gianesello (STM), Didier Belot (CEA)

o   Scope: investigates how Europe can establish leadership and sovereignty in communications and sensing.

o   Manged by Björn Debaillie (imec)

·        Expert Group #3: Sense & Power Chair Patrick Pype (NXP), vice-chair Manuela Neyer (Infineon)

o   Scope: contributes with a focus on supplementary core technologies that support the design of EG1 and EG2 and identifies essentials for controlling the telecommunication and vertical value chain.

o   Manged by Marina Plietsch (Infineon)

This roadmap starts by setting the scene on Europe’s current and future perspective on connectivity and providing an overview of the strategic trends and potential business opportunities in the areas of future connectivity and microelectronics. It carries out SWOT analyses on different market segments and identifies strategic actions for each strategic focus area and then concluded with a summary of strategic actions across the three strategic focus areas.

With this roadmap in hands, a new journey may begin, to truly realise and deliver the common vision of telecommunications and microelectronics industries, aiming at building a strong European position in those key digital technologies. Facing great uncertainties ahead in globalisation, geopolitics, post-pandemic economy and climate change, the road towards 6G and European digital sovereignty will be extremely challenging. The COREnect consortium may only wish this roadmap to provide food for thoughts, but more importantly a light, a compass, a map, and an action plan for Europe and all the related private and public stakeholders, to find their way and succeed in this journey.

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Memorandum of Understanding signed between AENEAS and 6G-IA

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“COREnect gathered a large spectrum of ICT value chain players along with worldwide recognised technical experts” - An interview with Mohand Achouche (Nokia)